Dongguan Tianrui Electronics Co., Ltd
Dongguan Tianrui Electronics Co., Ltd
Add to Cart
1206 Tape Pacakge Copper Elecment Small Quick Blow Fast Acting Surface Mount Chip Fuse
Description
12.000 Series are the fuses set the industry standard for perfor m a nce,reliability and
quality. The solder-free design provides excellent on-off andte m p erature cycling characteristics during use and also m akes our S M Dfuses m ore heat and shock tolerant than typical sub miniature fuses.
| E1 ectrical Characteristcs | |||
| Rated Current | 1. OIn | 2.5In | 3. 5In |
| 250mA~ 5A | 4hours, min . | 5 sec max. | - |
| 6A~ 30A | 4hours, min . | - | 5secmax. |
| Part No. | Rated Voltage (Vdc) | Rated Current (A) | Breaking Capacity | Typical Cold Resistance (mOhms)2 | Typical Voltage Drop (mV) | Typical Pre- Arcing I2t(A2 Sec)3 | Marking | |||||
| 12.000. 0. 25 | 0.25 | 300A@ 72/63 /32Vdc | 300a@ 24Vdc | 3500 | 1400 | 0.00038 | - | |||||
| 12.000. 0. 375 | 0.375 | 1750 | 730 | 0.00077 | - | |||||||
| 12. 000. 0.5 | 0.5 | 980 | 700 | 0.0019 | - | |||||||
| 12. 000. 0.75 | 0.75 | 800 | 700 | 0.15 | - | |||||||
| 12.000. 1 | 1 | 470 | 490 | 0.18 | H | |||||||
| 12. 000. 1.5 | 1.5 | 218 | 355 | 0.4 | K | |||||||
| 12.000. 2 | 2 | 133 | 305 | 1.1 | N | |||||||
| 12. 000.2.5 | 2.5 | 79 | 240 | 1.7 | O | |||||||
| 12. 000.3 | 3 | 49 | 185 | 2.2 | P | |||||||
| 12. 000.3. 5 | 3.5 | 37 | 180 | 2.7 | R | |||||||
| 12. 000.4 | 4 | 33 | 169 | 3.2 | S | |||||||
| 12.000. 4.5 | 72 | 72 | 63 | 32 | 24 | 4.5 | 28 | 160 | 4.2 | X | ||
| 12. 000. 5 | 5 | 23 | 140 | 6 | T | |||||||
| 12. 000. 6 | 6 | 15.5 | 150 | 12 | F | |||||||
| 12. 000. 7 | 7 | 11.5 | 130 | 18 | J | |||||||
| 12. 000. 8 | 8 | 7.3 | 110 | 18 | V | |||||||
| 12. 000. 10 | 10 | 6.5 | 90 | 30 | U | |||||||
| 12. 000. 12 | 12 | 4.7 | 90 | 45 | W | |||||||
| 12. 000. 15 | 15 | 3 | 90 | 33 | Y | |||||||
| 12. 000. 20 | 20 | 2 | 90 | 80 | Q | |||||||
| 12. 000. 25 | 25 | 3 | 90 | 60 | L | |||||||
| 12. 000. 30 | 30 | 2.1 | 90 | 100 | Z | |||||||
| Type | A | B | W | F | E |
| Spec | 3.50士0. 20 | 1.90士0. 20 | 8.00士0.20 | 3. 50士0.05 | 3. 50士0.05 |
| Type | P | P0 | P1 | DO | T |
| Spec | 4. 00士0. 10 | 4.00士0. 10 | 2.00士0.05 | 2.00士0.05 | 0. 75土0. 10 |
| Reflow Con diton | Pb-free asse m bly | |
| Pre Heat | -Te mperature Min (Ts(min)) | 1 50℃ |
| = Temperature Max (Ts(max)) | 200℃ | |
| -Time_ (Minto Max) (ts) | 60一120 seconds | |
| Average Ramp-up Rate ILiquidus Te mp | 3 ℃/second max | |
| TS(max) to TL- Ramp-up Rate | 5℃/second max | |
| Reflow | - Te mperature (TL) (Liquidus) 一Te mp erature (tL) | 217℃ 60 - 150 seconds |
| Peak Tem perature (TP) | I 260+0/-5℃ | |
| Time within 5° C of actual peak Te mperature (tP) | 30 seconds | |
| Ramp-down Rate Time 25° C to peak Te mperature (TP) Do not exceed | 6° C/second max 8 minutes max 260℃ | |
| Wave Soldering | 260 ℃ 10 seconds max. | |
| Materials | Body: Advanced Hi gh Te m perature Substrate Ter: mi natons: 100% Tin over Nickel over Copper Element Cover Coat: Confor mal C oating |
| Operatng Temperature | -55 ℃ to 125 ℃ Consult te mperature rerating curve chart. |
| Thermal Shock | W ithstands 5 cyclesof-55 ℃ to 125℃ |
| Hu mi dity | MIL-STD-202F,Method 103B, Condition D |
| Vi braton | Per MIL-STD-202F,Method 201A |
| Insulaton Resistance (Afer Opening) | Greater than 10, 000 ohms |
| Resistance to Soldering Heat | MIL-STD-202G, Method 210F,Cond ition D |
Contact Details:
Andy Wu
Email: andy@tianrui-fuse.com.cn
MP/Whatsapp: +86 13532772961
Wechat: HFeng0805
Skype: andywutechrich
QQ: 969828363