Dongguan Tianrui Electronics Co., Ltd
Dongguan Tianrui Electronics Co., Ltd
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4512 1245 Wireless Base Station Silver Plated Brass Large Current Fast Slow Acting Ceramic SMD Fuses Surface Mount Fuse
EBF Fast Acting SMD Fuses
| SCOPE | ||||||||||||||||||||
| Notebook PC | LCD/PDF TV | LCD/PDP panel | LCD monitor0 | |||||||||||||||||
| LCD backlight inverter | Portable DVE player | Power supply | Networking | |||||||||||||||||
| PC server | Cooling fan system | Storage system | Telecom system | |||||||||||||||||
| Wireless base station | White goods | Game console | Automotive | |||||||||||||||||
| Battery charging circuit | Office Automation | Industrial equipment | Medical equipment | |||||||||||||||||
Structure
| NO. | Component | Material | Quantity | ||||||||||||||||
| ① | Cap | Silver Plated Brass | 2 | ||||||||||||||||
| ② | Body | Ceramic tube | 1 | ||||||||||||||||
PRODUCT CHARACTERISTICS
| No. | Item | Contain | Reference standard | ||||||||||||||||
| 1 | Insulation Resistance | 10,000 ohms minimum | MIL-STD-202G, Method 302 Test ConditionA | ||||||||||||||||
| 2 | Solderability | T=235℃±5 ℃, t=5+0/-0.5s, Cover≧95% | MIL-STD-202G, Method 208H | ||||||||||||||||
| 3 | Resistance to Soldering Heat | 10 sec at 260℃ | MIL-STD-202G, Method 210F Test Condition B | ||||||||||||||||
| 4 | Thermal Shock | 5 cycles, -65℃ to 125℃, 15minutes @each extreme | MIL-STD-202G, Method 107G Test Condition B | ||||||||||||||||
| 5 | Mechanical Shock | 100G’s peak for 6 milliseconds, 3 cycles | MIL-STD-202G, Method 213B Test 1 | ||||||||||||||||
| 6 | Vibration | 0.03” amplitude, 10-55 Hz in 1 min. 2hrs each XYZ=6hrs | MIL-STD-202G, Method 201A | ||||||||||||||||
| 7 | Moisture Resistance | 10 cycles | MIL-STD-202G, Method 106G | ||||||||||||||||
| 8 | Salt spray | 48hrs | MIL-STD-202G, Method 101E Test Condition B | ||||||||||||||||
Pre-Arcing Time / Current Characteristics
| Ampere Rating | % of Ampere Rating | Opening Time | |||||||||||||
| 5A – 50A | 125% | 1 hours, Min . | |||||||||||||
| 200% | 2min, Max . | ||||||||||||||
| 1000% | 0.001 sec., Min.; 0.01 sec., Max. | ||||||||||||||
| Reflow Condition | Pb-Free assembly | ||||||||||||
| Preheating | -Temperature Min Ts(min) | 150℃ | |||||||||||
| -Temperature Max Ts(man) | 200℃ | ||||||||||||
| -Time Max | 120 secs | ||||||||||||
| Soldering | -Temperature (TL)(Liquidus) | 260℃ | |||||||||||
| -Time Max (TL) | 60 secs | ||||||||||||
| -Temperature (TP) | Max 260℃ | ||||||||||||
| -Time Max (TP) | 10 secs | ||||||||||||
EBT Time Delay SMD Fuses
| Scope | ||||||||||||||||
| Notebook PC | LCD/PDF TV | LCD/PDP panel | LCD monitor | |||||||||||||
| LCD backlight inverter | Portable DVE player | Power supply | Networking | |||||||||||||
| PC server | Cooling fan system | Storage system | Telecom system | |||||||||||||
| Wireless base station | White goods | Game console | Automotive | |||||||||||||
| Battery charging circuit | Office Automation | Industrial equipment | Medical equipment | |||||||||||||
Structure
| NO. | Component | Material | Quantity | ||||||||||||
| ① | Cap | Silver Plated Brass | 2 | ||||||||||||
| ② | Body | Ceramic tube | 1 | ||||||||||||
PRODUCT CHARACTERISTICS
| No. | Item | Contain | Reference standard | ||||||||||||
| 1 | Insulation Resistance | 10,000 ohms minimum | MIL-STD-202G, Method 302 Test ConditionA | ||||||||||||
| 2 | Solderability | T=235℃±5℃, t=5+0/-0.5s, Cover≧95% | MIL-STD-202G, Method 208H | ||||||||||||
| 3 | Resistance to Soldering Heat | 10 sec at 260℃ | MIL-STD-202G, Method 210F Test Condition B | ||||||||||||
| 4 | Thermal Shock | 5 cycles, -65℃ to 125℃, 15minutes @each extreme | MIL-STD-202G, Method 107G Test Condition B | ||||||||||||
| 5 | Mechanical Shock | 100G’s peak for 6 milliseconds, 3 cycles | MIL-STD-202G, Method 213B Test 1 | ||||||||||||
| 6 | Vibration | 0.03” amplitude, 10-55 Hz in 1 min. 2hrs each XYZ=6hrs | MIL-STD-202G, Method 201A | ||||||||||||
| 7 | Moisture Resistance | 10 cycles | MIL-STD-202G, Method 106G | ||||||||||||
| 8 | Salt spray | 48hrs | MIL-STD-202G, Method 101E Test Condition B | ||||||||||||
Pre-Arcing Time / Current Characteristics
| Ampere Rating | % of Ampere Rating | Opening Time | |||||||||||
| 500mA – 40A | 125% | 1 hours, Min . | |||||||||||
| 200% | 2min, Max . | ||||||||||||
| 1000% | 0.001 sec., Min.; 0.01 sec., Max. | ||||||||||||
| Reflow Condition | Pb-Free assembly | |||||||||
| Preheating | -Temperature Min Ts(min) | 150℃ | ||||||||
| -Temperature Max Ts(man) | 200℃ | |||||||||
| -Time Max | 120 secs | |||||||||
| Soldering | -Temperature (TL)(Liquidus) | 260℃ | ||||||||
| -Time Max (TL) | 60 secs | |||||||||
| -Temperature (TP) | Max 260℃ | |||||||||
| -Time Max (TP) | 10 secs | |||||||||
Contact Details:
Andy Wu
Email: andy@tianrui-fuse.com.cn
MP/Whatsapp: +86 13532772961
Wechat: HFeng0805
Skype: andywutechrich
QQ: 969828363